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Lernmaterialien für design an der TU Berlin

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TESTE DEIN WISSEN

You design a multi-layer bord for high speed applications. List aspects that you need to consider when assigning the layers to signal/ ground/ Vcc.

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TESTE DEIN WISSEN

signal planes seperated from each other.  (ground between the two layers if possible)  sgsv


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TESTE DEIN WISSEN

Explain the simultaneous switching noise, its effects and mitigation strategies.

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TESTE DEIN WISSEN

line inductivity of the gates can lead in high frequency to voltage losses, system failures due to false switching. (capacitors to lower impact, or split planes to prevent causes)

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TESTE DEIN WISSEN

Discuss criteria for good placement

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TESTE DEIN WISSEN

minimize area

minimize wire len

minimize parasitics

plan routing areas ahead

homogenous temperature

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TESTE DEIN WISSEN

Explain the steps of a typical numerical simulation.

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TESTE DEIN WISSEN

0. Build model

1. Discretize the region

4. Include boundary conditions

5. Solve system of linear equations

7. Post-processing

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TESTE DEIN WISSEN

What are characteristic time scales for RF lines?

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TESTE DEIN WISSEN

mhz ghz

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TESTE DEIN WISSEN

Which packaging types are suitable for high frequencies? Which types are applied in case of high levels of power dissipation?

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TESTE DEIN WISSEN

(high f low P) fan out

(<<f <<P)  Quad flat

(>>P) power modules, ceramic lid with cu flange


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TESTE DEIN WISSEN

List parts of a signal path.

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TESTE DEIN WISSEN

bonding structures (wire bonds)

signal traces

vias 

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TESTE DEIN WISSEN

List examples for design flows and development processes

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TESTE DEIN WISSEN

v-model, frauenhofer izm, waterfall, spiral, automobile( with multiple muster)


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TESTE DEIN WISSEN

What are the levels 0/ 1/ 2/ 3 in packaging?

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TESTE DEIN WISSEN

0 wafer

1 chip

2 pcb

3 end device


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TESTE DEIN WISSEN

List methods to determine the wiring demand

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TESTE DEIN WISSEN

1.measure total length (but many informations needed)

2.assumption by counting wires through cutting plane

3. assumption over average winter connection length (feuer davis)

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TESTE DEIN WISSEN

Explain the “M“s in the M3 design approach.

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TESTE DEIN WISSEN

method: develop a method to efficently realize the concept

model: implement this methology into a model, and experiment with it

measures: what did you learn from this procedure


minimizes redesigns and therefore reduces costs


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TESTE DEIN WISSEN

Sketch the signal at the output of a line based on the input, line and output impedance?

Lösung anzeigen
TESTE DEIN WISSEN

z1>z long rise

z1<z oscilation


in open end

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Q:

You design a multi-layer bord for high speed applications. List aspects that you need to consider when assigning the layers to signal/ ground/ Vcc.

A:

signal planes seperated from each other.  (ground between the two layers if possible)  sgsv


Q:

Explain the simultaneous switching noise, its effects and mitigation strategies.

A:

line inductivity of the gates can lead in high frequency to voltage losses, system failures due to false switching. (capacitors to lower impact, or split planes to prevent causes)

Q:

Discuss criteria for good placement

A:

minimize area

minimize wire len

minimize parasitics

plan routing areas ahead

homogenous temperature

Q:

Explain the steps of a typical numerical simulation.

A:

0. Build model

1. Discretize the region

4. Include boundary conditions

5. Solve system of linear equations

7. Post-processing

Q:

What are characteristic time scales for RF lines?

A:

mhz ghz

Mehr Karteikarten anzeigen
Q:

Which packaging types are suitable for high frequencies? Which types are applied in case of high levels of power dissipation?

A:

(high f low P) fan out

(<<f <<P)  Quad flat

(>>P) power modules, ceramic lid with cu flange


Q:

List parts of a signal path.

A:

bonding structures (wire bonds)

signal traces

vias 

Q:

List examples for design flows and development processes

A:

v-model, frauenhofer izm, waterfall, spiral, automobile( with multiple muster)


Q:

What are the levels 0/ 1/ 2/ 3 in packaging?

A:

0 wafer

1 chip

2 pcb

3 end device


Q:

List methods to determine the wiring demand

A:

1.measure total length (but many informations needed)

2.assumption by counting wires through cutting plane

3. assumption over average winter connection length (feuer davis)

Q:

Explain the “M“s in the M3 design approach.

A:

method: develop a method to efficently realize the concept

model: implement this methology into a model, and experiment with it

measures: what did you learn from this procedure


minimizes redesigns and therefore reduces costs


Q:

Sketch the signal at the output of a line based on the input, line and output impedance?

A:

z1>z long rise

z1<z oscilation


in open end

design

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