Design at TU Berlin | Flashcards & Summaries

Lernmaterialien für design an der TU Berlin

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TESTE DEIN WISSEN

Explain the difference between a suitable model and a model that is too detailed/ not detailed enough.

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TESTE DEIN WISSEN

  transistor, (tunnel effect, microscopic effects)

or simulation mesh (more detailed but makes no difference)

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TESTE DEIN WISSEN

Discuss criteria for good placement

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TESTE DEIN WISSEN

minimize area

minimize wire len

minimize parasitics

plan routing areas ahead

homogenous temperature

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TESTE DEIN WISSEN

You design a multi-layer bord for high speed applications. List aspects that you need to consider when assigning the layers to signal/ ground/ Vcc.

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TESTE DEIN WISSEN

signal planes seperated from each other.  (ground between the two layers if possible)  sgsv


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TESTE DEIN WISSEN

Sketch the signal at the output of a line based on the input, line and output impedance?

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TESTE DEIN WISSEN

z1>z long rise

z1<z oscilation


in open end

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TESTE DEIN WISSEN

Which aspects are significant for the development of RF packages?

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TESTE DEIN WISSEN

right design (fan out). emv durable

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TESTE DEIN WISSEN

What are the levels 0/ 1/ 2/ 3 in packaging?

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TESTE DEIN WISSEN

0 wafer

1 chip

2 pcb

3 end device


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TESTE DEIN WISSEN

List methods to determine the wiring demand

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TESTE DEIN WISSEN

1.measure total length (but many informations needed)

2.assumption by counting wires through cutting plane

3. assumption over average winter connection length (feuer davis)

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TESTE DEIN WISSEN

What is the difference between Fan-out and Chip-Scale packaging?

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TESTE DEIN WISSEN

fan out (interconnects get drawn out of the waver) 

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TESTE DEIN WISSEN

Which packaging types are suitable for high frequencies? Which types are applied in case of high levels of power dissipation?

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TESTE DEIN WISSEN

(high f low P) fan out

(<<f <<P)  Quad flat

(>>P) power modules, ceramic lid with cu flange


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TESTE DEIN WISSEN

List parts of a signal path.

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TESTE DEIN WISSEN

bonding structures (wire bonds)

signal traces

vias 

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TESTE DEIN WISSEN

Explain the “M“s in the M3 design approach.

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TESTE DEIN WISSEN

method: develop a method to efficently realize the concept

model: implement this methology into a model, and experiment with it

measures: what did you learn from this procedure


minimizes redesigns and therefore reduces costs


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TESTE DEIN WISSEN

What are characteristic time scales for RF lines?

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TESTE DEIN WISSEN

mhz ghz

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Q:

Explain the difference between a suitable model and a model that is too detailed/ not detailed enough.

A:

  transistor, (tunnel effect, microscopic effects)

or simulation mesh (more detailed but makes no difference)

Q:

Discuss criteria for good placement

A:

minimize area

minimize wire len

minimize parasitics

plan routing areas ahead

homogenous temperature

Q:

You design a multi-layer bord for high speed applications. List aspects that you need to consider when assigning the layers to signal/ ground/ Vcc.

A:

signal planes seperated from each other.  (ground between the two layers if possible)  sgsv


Q:

Sketch the signal at the output of a line based on the input, line and output impedance?

A:

z1>z long rise

z1<z oscilation


in open end

Q:

Which aspects are significant for the development of RF packages?

A:

right design (fan out). emv durable

Mehr Karteikarten anzeigen
Q:

What are the levels 0/ 1/ 2/ 3 in packaging?

A:

0 wafer

1 chip

2 pcb

3 end device


Q:

List methods to determine the wiring demand

A:

1.measure total length (but many informations needed)

2.assumption by counting wires through cutting plane

3. assumption over average winter connection length (feuer davis)

Q:

What is the difference between Fan-out and Chip-Scale packaging?

A:

fan out (interconnects get drawn out of the waver) 

Q:

Which packaging types are suitable for high frequencies? Which types are applied in case of high levels of power dissipation?

A:

(high f low P) fan out

(<<f <<P)  Quad flat

(>>P) power modules, ceramic lid with cu flange


Q:

List parts of a signal path.

A:

bonding structures (wire bonds)

signal traces

vias 

Q:

Explain the “M“s in the M3 design approach.

A:

method: develop a method to efficently realize the concept

model: implement this methology into a model, and experiment with it

measures: what did you learn from this procedure


minimizes redesigns and therefore reduces costs


Q:

What are characteristic time scales for RF lines?

A:

mhz ghz

design

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