Production of Optoelectronical Systems at Leibniz Universität Hannover

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Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

What stands for DFN?

Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Name the processes that belong to the Front End

Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Why is the Wafer thinning required

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Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Name the process for the Mechanical die singulation

Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Name the Laser-based Die singulation processes


Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

What is the name of the process in which semiconductor chips are produced on a wafer?

Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Dicing Methods

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Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Which parameters of the adhesive influence with Bondline Thickness?

Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

What does the abbreviation DTFS stand for?

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What is a blue tape?

Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Which two blue tape types do you know?

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Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Why do vibrations can occur during the wafer dicing?


One or more reasons

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Exemplary flashcards for Production of Optoelectronical Systems at the Leibniz Universität Hannover on StudySmarter:

Production of Optoelectronical Systems

What stands for DFN?
Dual Flat No - Lead

Production of Optoelectronical Systems

Name the processes that belong to the Front End

  • Cleaning

  • Layer Growth/Layer Deposition

  • Lithography

  • Etching

  • Doping

  • CMP (Chemical Mechanical Polishing)






Production of Optoelectronical Systems

Why is the Wafer thinning required

  • Reduction of Complexity of the further separation process

  • Reduction of the Thermal resistance

  • Reduction of the package size

Production of Optoelectronical Systems

Name the process for the Mechanical die singulation

1) Scribe and break "SB"

2) Blade dicing "BD"

3) Dice before grind (DBG)

Production of Optoelectronical Systems

Name the Laser-based Die singulation processes


  1. Ablative laser dicing 

  2. Water-jet-guided laser dicing 

  3. thermal-laser-separation 

  4. stealth dicing

Production of Optoelectronical Systems

What is the name of the process in which semiconductor chips are produced on a wafer?

FRONT-END PROCESS

Production of Optoelectronical Systems

Dicing Methods

“SB” for Scribe and Break

Production of Optoelectronical Systems

Which parameters of the adhesive influence with Bondline Thickness?

Viscosity


Production of Optoelectronical Systems

What does the abbreviation DTFS stand for?

Deform Trim Form Singulation

Production of Optoelectronical Systems

What is a blue tape?

Self - adhesive plastic foil

Production of Optoelectronical Systems

Which two blue tape types do you know?

  • Pressure - sensitive tapes

  • UV tapes

Production of Optoelectronical Systems

Why do vibrations can occur during the wafer dicing?


One or more reasons
The edge of the saw blade is in contact with the glue.


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